Atlas: Mathematical Modeling of the void evolution dynamics under the action of electromigration and cappilary forces in thin interconnects by Emre Ersin Oren

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International Conference on Mathematical Modeling and Scientific Computing
April 2-6, 2001
Middle East Technical University and Selcuk University
Ankara and Konya, Turkey

Organizers
F. Bornemann (Munich University of Tecnology, Germany), H. Bulgak (Selcuk University, Konya, Turkey), V. Ganzha (Munich University of Technology, Germany), B. Karasozen (METU, Ankara, Turkey), A. Sinan (Selcuk University, Konya, Turkey), C. Zenger (Munich University of Technology, Germany)

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Mathematical Modeling of the void evolution dynamics under the action of electromigration and cappilary forces in thin interconnects
by
Emre Ersin Ören
Metallurgical Materials Engineering Department, METU
Coauthors: Tarik Ogurtani(Metallurgical Materials Engineering Department, METU)

In these studies a comprehensive picture of void growth dynamics in connection with the critical morphological evolutions has been thoroughly anticipated in order to understand main reasons as well as the conditions under which premature failure of metallic thin interconnects occurs. Our mathematical model on the anisotropic diffusion and mass accumulation on void surfaces, under the action of applied electrostatic potential and capillary effects, follows a novel irreversible but discrete thermodynamic formalism of interphases and surfaces, which automatically takes care of the interface reaction controlled growth process rather rigorously.

Extensive computer simulation experiments have been performed on the configurational changes associated with voids during the intragranual motions in two-dimensional space, utilizing various initial void morphologies with and without diffusional anisotropy. As a result, in addition to the wedge shape or slit formations, very rich and also unusual void morphological variations such as fragmentations or dendritic growth have been obtained. In these numerical experiments which shows excellent agreement with SEM and/or TEM studies reported in the literature, the Euler's method of finite differences with an automatic time step self-adjustment has been utilized in combination with a rather powerful and fast boundary element method (BEM) for the solution of the Laplace equation.

Date received: February 12, 2001